The 12-layer 5G communication PCB is a multi-layer circuit board designed to meet the high-performance requirements of future 5G communication networks.
12-Layer 5G Communication PCB Product Introduction
1.Product Overview
The 12-layer 5G communication PCB is a multi-layer circuit board designed to meet the high-performance requirements of future 5G communication networks. It uses advanced materials and manufacturing processes to achieve high-speed data transmission, low latency and high-reliability signal processing. This product is widely used in 5G base stations, antennas, routers and other communication equipment, and is an important part of 5G network infrastructure.
2.Product Features
1.Superior high-frequency performance:
2.Use low dielectric constant (Dk) and low dielectric loss (Df) materials to ensure the stability and integrity of the signal under high-frequency operation, meeting the stringent standards of 5G communication.
3.Multi-layer structure design:
4.12-layer design provides higher wiring density and complex circuit design capabilities, making the management and processing of high-speed signals more efficient and adaptable to a variety of application requirements.
5.Excellent heat dissipation performance:
6.Adopting optimized thermal management design, ensure that the circuit board can effectively dissipate heat in a high-power working environment, extend service life and improve system stability.
7.High reliability:
8.Through strict quality control and testing, ensure the reliability of the product under various harsh environmental conditions, suitable for long-term use.
9.Strong anti-interference ability:
10.Electromagnetic compatibility (EMC) is taken into consideration in the design. Through good electromagnetic shielding and signal isolation, the impact of external interference on the signal is reduced and the communication quality is improved.
11.Lightweight and compact design:
12.Using advanced materials and design concepts, the weight and volume of the circuit board are optimized, which is convenient for integration into various compact communication devices.
3.Technical Specifications
| Number of layers | 12 layers | Ink color | green oil white text |
| Material | FR-4, SY1000-2 | Minimum line width/line spacing | 0.075mm/0.075mm |
| Thickness | 2.0mm | Is there solder mask | yes |
| Copper thickness | inner 0.1 outer layer 1OZ | Surface treatment | immersion gold + electro-thick gold 30 wheat |
4.Application Areas
5G base station: As the core component of the base station, it supports RF module, signal processing unit and power management.
Antenna system: used for the transmission and reception of high-frequency signals to ensure good signal coverage.
Network equipment: such as routers, switches, etc., supporting high-speed data transmission and processing.
IoT devices: provide a stable communication foundation for smart devices and IoT applications.
5.Production Process
Precision etching and laser drilling: ensure the accuracy of high-density interconnect (HDI) design to meet the requirements of complex circuit layout.
Multi-layer lamination technology: use high temperature and high pressure process to combine multiple layers of materials to ensure electrical performance and mechanical strength.
Surface treatment: a variety of surface treatment methods can be selected, such as chemical gold plating (ENIG), hot air leveling (HASL), etc., to improve welding reliability and corrosion resistance.
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6.Conclusion
The 12-layer 5G communication circuit board has become an indispensable and important part of modern 5G communication equipment with its excellent performance, reliability and broad application prospects. Whether in signal transmission, thermal management or anti-interference ability, the circuit board has shown significant advantages, helping the rapid development and widespread application of 5G technology.
FAQ:
1.Q: How far is your factory from the nearest airport?
A: About 30 kilometers
2.Q: What is your minimum order quantity?
A: One piece is enough to place an order.
3.Q: When can I get a quotation after I provide Gerber, product process requirements?
A: Our sales staff will give you a quotation within 1 hour.
4.Q: How to solve the common overheating problems when using communication PCB boards?
A: The key is to introduce heat dissipation design and or choose high quality materials. For example: EMC, TUC, Rogers and other companies to provide the board.
5.Q: How to avoid high-frequency and high-speed PCB circuit board common signal interference?
A: The need to optimize the PCB layout and reasonable planning of the ground to reduce the impact of interference.
6.Q: Do you have laser drilling machines?
A: We have the most advanced laser drilling machine in the world.
7.Q: Can your company manufacture impedance boards and crimp hole circuit boards?
A: We can produce impedance PCBs, and the same product can be made with multiple impedance values. We can also manufacture precision holes for crimp holes.
