The banking equipment control PCBA is a highly stable printed circuit board assembly designed specifically for the financial industry, integrating complex electronic systems to ensure the reliable operation and data processing of key equipment such as ATMs and banking terminals.
Product Description:
The banking equipment control PCBA is a highly stable printed circuit board assembly designed specifically for the financial industry, integrating complex electronic systems to ensure the reliable operation and data processing of key equipment such as ATMs and banking terminals.
Application Field:
ATMs
Banking Terminals
Financial Transaction Systems
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Sanxis Tech, with decades of expertise in PCBA electronics manufacturing, offers premium-grade materials and bespoke component sourcing. We ensure high-quality craftsmanship with advanced SMT equipment, strictly adhering to ISO standards. Our three key strengths are: 1. Automated SMT and DIP production lines with high capacity and precision equipment; 2. A dedicated manufacturing team with extensive experience and regular training; 3. Adaptability to high-end manufacturing, providing a production channel for premium products of other company in worldwide. |
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| Process of PCBA |
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| Process | Item | Parameter |
| Printing | Processable PCB Size | 900*600mm² |
| Processed Panel Weight | 8kg | |
| Placement | BGA Capability | 01005,0201,0402,0603 |
| Component Height | 0.2-25mm | |
| Small BGA Pitch | 0.25-2.0mm | |
| Small BGA Size | 0.1-0.63mm | |
| Small QFP Size | 0.35mm | |
| Small Component Size | 50*30mm | |
| Placement Size | 850*560mm | |
| Placement Accuracy Range | ±22μm (3σ), ±0.05° (3σ) | |
| Panel Thickness Range | 0.3mm--6mm | |
| Panel Weight | 6kg | |
| Processable Component Weight | 100g | |
| Line Can Hold Material Types | 500 | |
| SPI | Detectable Small Solder Ball Pitch | 100μm |
| X-Y Axis Accuracy | 0.5μm | |
| False Detection Rate | ≤0.1% | |
| AOI | Detectable Small Component | 1005 |
| Detectable Defects | Wrong component, Missing component, Reversed, Placement deviation, Tombstoning, Laying on side, Cold solder, Bridging, Overturned | |
| Warp Detection | 3D Detection Function | |
| Reflow | Temperature Accuracy | ±1℃ |
| Soldering Protection | Nitrogen protection (Oxygen content <3000ppm) | |
| Nitrogen Control | Nitrogen closed-loop automatic control system, ±200ppm | |
| Product Type | Flexible board, Rigid board, Rigid-flex board | |
