Product Description: The Server Processing Motherboard PCBA is specifically designed for high-speed data processing and stable uploading, integrating high-performance processors and large-capacity memory, ensuring efficient and reliable server operation.
Product Description:
The Server Processing Motherboard PCBA is specifically designed for high-speed data processing and stable uploading, integrating high-performance processors and large-capacity memory, ensuring efficient and reliable server operation.
Application Field:
1.Data Centers
2.Cloud Computing Services
3.Enterprise-level Storage Solutions
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Sanxis Tech, with decades of expertise in PCBA electronics manufacturing, offers premium-grade materials and bespoke component sourcing. We ensure high-quality craftsmanship with advanced SMT equipment, strictly adhering to ISO standards. Our three key strengths are: 1. Automated SMT and DIP production lines with high capacity and precision equipment; 2. A dedicated manufacturing team with extensive experience and regular training; 3. Adaptability to high-end manufacturing, providing a production channel for premium products of other company in worldwide. |
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| Process of PCBA |
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| Process | Item | Parameter |
| Printing | Processable PCB Size | 900*600mm² |
| Processed Panel Weight | 8kg | |
| Placement | BGA Capability | 01005,0201,0402,0603 |
| Component Height | 0.2-25mm | |
| Small BGA Pitch | 0.25-2.0mm | |
| Small BGA Size | 0.1-0.63mm | |
| Small QFP Size | 0.35mm | |
| Small Component Size | 50*30mm | |
| Placement Size | 850*560mm | |
| Placement Accuracy Range | ±22μm (3σ), ±0.05° (3σ) | |
| Panel Thickness Range | 0.3mm--6mm | |
| Panel Weight | 6kg | |
| Processable Component Weight | 100g | |
| Line Can Hold Material Types | 500 | |
| SPI | Detectable Small Solder Ball Pitch | 100μm |
| X-Y Axis Accuracy | 0.5μm | |
| False Detection Rate | ≤0.1% | |
| AOI | Detectable Small Component | 1005 |
| Detectable Defects | Wrong component, Missing component, Reversed, Placement deviation, Tombstoning, Laying on side, Cold solder, Bridging, Overturned | |
| Warp Detection | 3D Detection Function | |
| Reflow | Temperature Accuracy | ±1℃ |
| Soldering Protection | Nitrogen protection (Oxygen content <3000ppm) | |
| Nitrogen Control | Nitrogen closed-loop automatic control system, ±200ppm | |
| Product Type | Flexible board, Rigid board, Rigid-flex board | |
