Next, let’s continue to introduce the second equipment system for Dry Etching Process: ICP, which stands for Inductively Coupled Plasma system.
In the ICP system, Radio Frequency (RF) energy is transferred to low-pressure gas through a coil, causing the gas to ionize and form plasma. This plasma is generated under the induction of a radio frequency electromagnetic field, hence the name Inductively Coupled Plasma. This technology provides a high-density plasma, which is crucial for the formation of fine structures in semiconductor manufacturing processes, as it can achieve more precise and uniform etching effects
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In next new, we will learn about the CCP system.
