Today let’s continue to the next tip in PCB routing:
In the context of PCB manufacturing, minimizing crosstalk between traces is crucial for maintaining signal integrity. Crosstalk levels depend on the length and distance between two traces. In certain areas, trace routing may reach a bottleneck where traces are closer than expected. In such cases, it is necessary to increase the distance between adjacent signals beyond the minimum requirements.
To mitigate this issue, the spacing between traces should be increased in the bottleneck areas. This not only meets the minimum requirements but also provides additional clearance, which can further reduce crosstalk and improve signal quality. By ensuring that the distance between traces is at least four times the trace width and that each bend in a serpentine trace is 1.5 times the trace width, designers can help maintain signal stability and reliability, especially in high-speed applications. This practice is essential for high-density PCB designs where trace proximity is a common challenge.
