Here is the next tip in PCB routing:
In the context of PCB manufacturing, vias are crucial structures for connecting signals and power between different layers. However, the gaps created by vias in the power and ground planes can lead to uneven current density, resulting in hotspots. Hotspots refer to areas where the current density is abnormally high, which can cause localized overheating and affect the reliability and performance of the circuit.
To avoid hotspots, an effective routing trick is to place vias evenly within a grid on the PCB, leaving enough space between the vias for the power plane to distribute current uniformly. Typically, a via spacing of at least 15mil (0.015 inches) is recommended to help reduce the formation of hotspots and maintain the thermal stability and electrical performance of the circuit board.
By doing so, vias not only effectively connect the different layers but also reduce thermal issues caused by current concentration, thereby improving the overall performance and reliability of the PCB. This routing method is particularly suitable for high-density and high-current applications, such as power management and high-speed signal transmission.
