As the demand for high-performance computing grows, the semiconductor industry is exploring new materials to enhance the speed and efficiency of chip integration. Glass substrates, with their advantages in packaging processes such as increased interconnect density and faster signal transmission speeds, have become the industry's new darling.
Despite technical and cost challenges, companies like Schott, Intel, and Samsung are accelerating the commercialization of glass substrates. Schott has begun providing customized solutions for the Chinese semiconductor industry, Intel plans to launch glass substrates for advanced chip packaging by 2030, and Samsung is also advancing its production. Although glass substrates are more expensive, it is expected that with the maturation of manufacturing processes, they will be widely used in advanced packaging. The industry consensus is that the use of glass substrates has become a trend in advanced packaging.
