In the context of semiconductor packaging, glass substrates are emerging as a key material and a new hotspot in the industry. Companies like NVIDIA, Intel, Samsung, AMD, and Apple are reportedly adopting or exploring glass substrate chip packaging technologies. The reason for this sudden interest is the increasing limitations imposed by physical laws and production technologies on chip manufacturing, coupled with the growing demand for AI computing, which calls for higher computational power, bandwidth, and interconnect density.
Glass substrates are materials used to optimize chip packaging, enhancing performance by improving signal transmission, increasing interconnect density, and thermal management. These characteristics give glass substrates an edge in high-performance computing (HPC) and AI chip applications. Leading glass manufacturers like Schott have established new divisions, such as "Semiconductor Advanced Packaging Glass Solutions," to cater to the semiconductor industry. Despite the potential of glass substrates over organic substrates in advanced packaging, challenges in process and cost remain. The industry is accelerating the scale-up for commercial use.
