Sanxis Tech proudly introduces its latest breakthrough: the 8-Layer High-Temperature-Resistant Industrial Control Gold Finger PCB. Designed for extreme industrial environments, this PCB leverages advanced materials and precision engineering to deliver unmatched reliability in high-temperature, high-humidity, and high-stress applications. It is tailored for industrial automation, automotive electronics, aerospace, and medical equipment, ensuring stable signal transmission in demanding conditions.
Core Material Technology: High-Performance Substrates & Solder Mask
1. T180A Substrate: Engineered for Extreme Heat
l Superior Thermal Stability: With a glass transition temperature (Tg) of 175°C and thermal decomposition temperature (Td) of 340°C, the T180A substrate maintains stable electrical performance even under prolonged exposure to 175°C, minimizing delamination risks.
l Low Signal Loss: Dielectric constant (Dk) ≈4.4 at 1GHz and dissipation factor (Df) ≤0.016, ideal for high-speed signal integrity in 5G modules and industrial control systems.
l Enhanced Mechanical Strength: Reinforced with inorganic fillers, it achieves a bending strength of 500-530 N/mm², supporting complex multilayer designs.
2. TAIYO INK High-Temp Solder Mask
l Material: Features TAIYO INK’s PSR-4000 Series Green Solder Mask, optimized for extreme environments.
l Key Advantages:
l Heat Resistance: Passes 150°C thermal storage tests with excellent thermal shock resistance.
l Eco-Friendly Compliance: RoHS-certified and fully compatible with T180A substrates.
l Durability: Combined with 3U immersion gold surface treatment, it ensures over 5,000 insertion cycles for gold-plated edge connectors.
Advanced Design & Technical Specifications
1. High-Density Layout Engineering
l 8-Layer Structure: Ultra-thin 1.0mm profile enables compact integration of complex circuits.
l Precision Manufacturing:
l Trace Width/Spacing: 0.05mm/0.05mm (4MIL), meeting miniaturization demands.
l Minimum Hole Size: 0.5mm, enhancing via reliability in multilayer boards.
l Thermal Management: 1oz copper thickness improves heat dissipation, ensuring stability under high loads.
2. Key Specifications
Data |
technical specifications |
Layer |
8 layers mixed structure |
Material |
R5725S + T180A |
Thickness |
1.0mm±0.1mm |
Copper Thickness |
1oz out layer/1oz inner layer |
Trace Width/Spacing |
0.05mm/0.05mm |
Surface Treatment |
3U Immersion Gold |
Applications & Market Value
l Industrial Automation: Robust control boards for high-temperature robotics and power monitoring systems.
l Automotive Electronics: Engine control units (ECUs) and sensors, operable from -40°C to +150°C.
l Aerospace: Satellite communication devices, validated under extreme thermal and vibration tests.
l Medical Equipment: Critical control modules for MRI and CT systems, ensuring long-term reliability.
Quality Assurance & Global Support
Sanxis Tech, with state-of-the-art facilities in Hunan and Shenzhen, offers:
l Fast Delivery: Standard products shipped within 15 days; custom designs accommodated.
l Technical Expertise: Free thermal simulation and signal integrity analysis services.
l Certifications: Compliant with ISO 9001, IATF 16949, and UL standards.
Ordering & Inquiries
For detailed specifications or bulk orders, visit the Sanxis Tech product page or contact our sales team directly via the "Contact Us" portal.
Sanxis Tech is a leading high-tech enterprise specializing in high-end PCB R&D and manufacturing. With a focus on material innovation and precision engineering, we deliver reliable solutions for industrial control, automotive electronics, and telecommunications,