Company News

Sanxis New Product: 8-Layer High-Temperature-Resistant Industrial Control Gold Finger PCB (Part 25)

2025-02-27

8-Layer High-Temperature-Resistant Industrial Control Gold Finger PCB

Sanxis Tech proudly introduces its latest breakthrough: the 8-Layer High-Temperature-Resistant Industrial Control Gold Finger PCB. Designed for extreme industrial environments, this PCB leverages advanced materials and precision engineering to deliver unmatched reliability in high-temperature, high-humidity, and high-stress applications. It is tailored for industrial automation, automotive electronics, aerospace, and medical equipment, ensuring stable signal transmission in demanding conditions.  

 

Core Material Technology: High-Performance Substrates & Solder Mask

 

1. T180A Substrate: Engineered for Extreme Heat

Superior Thermal Stability: With a glass transition temperature (Tg) of 175°C and thermal decomposition temperature (Td) of 340°C, the T180A substrate maintains stable electrical performance even under prolonged exposure to 175°C, minimizing delamination risks.  

Low Signal Loss: Dielectric constant (Dk) 4.4 at 1GHz and dissipation factor (Df) 0.016, ideal for high-speed signal integrity in 5G modules and industrial control systems.  

Enhanced Mechanical Strength: Reinforced with inorganic fillers, it achieves a bending strength of 500-530 N/mm², supporting complex multilayer designs.  

 

2. TAIYO INK High-Temp Solder Mask

Material: Features TAIYO INK’s PSR-4000 Series Green Solder Mask, optimized for extreme environments.  

Key Advantages:  

Heat Resistance: Passes 150°C thermal storage tests with excellent thermal shock resistance.  

Eco-Friendly Compliance: RoHS-certified and fully compatible with T180A substrates.  

 

Durability: Combined with 3U immersion gold surface treatment, it ensures over 5,000 insertion cycles for gold-plated edge connectors.

 

 

Advanced Design & Technical Specifications

8-Layer High-Temperature-Resistant Industrial Control Gold Finger PCB

1. High-Density Layout Engineering

8-Layer Structure: Ultra-thin 1.0mm profile enables compact integration of complex circuits.

Precision Manufacturing:

Trace Width/Spacing: 0.05mm/0.05mm (4MIL), meeting miniaturization demands.  

Minimum Hole Size: 0.5mm, enhancing via reliability in multilayer boards.  

 

Thermal Management: 1oz copper thickness improves heat dissipation, ensuring stability under high loads.  

 

2. Key Specifications

 

 Data

 technical specifications

 Layer

 8 layers mixed structure

 Material

 R5725S + T180A

 Thickness

1.0mm±0.1mm

Copper Thickness

 1oz out layer/1oz inner layer

Trace Width/Spacing

 0.05mm/0.05mm

Surface Treatment

 3U Immersion Gold

 

Applications & Market Value

High Temperature Condition

Industrial Automation: Robust control boards for high-temperature robotics and power monitoring systems.  

Automotive Electronics: Engine control units (ECUs) and sensors, operable from -40°C to +150°C.  

Aerospace: Satellite communication devices, validated under extreme thermal and vibration tests.  

 

Medical Equipment: Critical control modules for MRI and CT systems, ensuring long-term reliability.

 

 

Quality Assurance & Global Support

Industrial Control Furnace

Sanxis Tech, with state-of-the-art facilities in Hunan and Shenzhen, offers:  

Fast Delivery: Standard products shipped within 15 days; custom designs accommodated.  

Technical Expertise: Free thermal simulation and signal integrity analysis services.  

 

Certifications: Compliant with ISO 9001, IATF 16949, and UL standards.  

 

 

Ordering & Inquiries

For detailed specifications or bulk orders, visit the Sanxis Tech product page or contact our sales team directly via the "Contact Us" portal.

 

 

Sanxis Tech is a leading high-tech enterprise specializing in high-end PCB R&D and manufacturing. With a focus on material innovation and precision engineering, we deliver reliable solutions for industrial control, automotive electronics, and telecommunications,