Four-layer gold finger board module PCB board is a printed circuit board designed for connection and signal transmission, which is widely used in various electronic devices, such as computers, communication equipment and consumer electronics.
Four-layer Gold Finger Board Module PCB Board Product Introduction
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1.Product Overview
Four-layer gold finger board module PCB board is a printed circuit board designed for connection and signal transmission, which is widely used in various electronic devices, such as computers, communication equipment and consumer electronics. Gold Finger refers to a metallization treatment on the edge of the circuit board, which is used to provide reliable electrical connection and ensure stable signal transmission.
2.Main Features
Four-layer design:
Adopt four-layer PCB structure to provide good signal integrity and power management.
Through reasonable stacking design, signal interference and crosstalk are effectively reduced.
Gold finger technology:
Adopt gold finger treatment on the edge of PCB to provide excellent conductivity and wear resistance.
Ensure reliable connection with slots or connectors, suitable for application scenarios with frequent plugging and unplugging.
High reliability:
Adopt high-quality materials and advanced manufacturing processes to ensure the stability of PCB in various environments.
Have good moisture resistance, shock resistance and chemical corrosion resistance.
Excellent electrical performance:
Design supports high-speed signal transmission, suitable for data communication and video signal transmission.
Use proper impedance control and differential signal design to ensure signal integrity.
Multiple surface treatments:
Provide multiple surface treatment options such as ENIG, HASL, OSP, etc. to meet different customer needs.
Adapt to different welding processes and environmental requirements.
3.Technical Specifications
| Number of layers | 4 layers | Ink color | green oil white text |
| Material | FR-4, S1000 | Minimum line width/line spacing | 0.1mm/0.1mm |
| Thickness | 1.6mm | Gold finger thickness | 30 wheat |
| Copper thickness | inner 0.5 outer layer 1OZ | Surface treatment | immersion gold |
4.Application Areas
Computer: for motherboards, expansion cards and other computer components.
Communication equipment: for routers, switches and other network equipment.
Consumer electronics: used in smartphones, tablets and other electronic products.
Industrial equipment: used in various industrial control and automation equipment.
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5.Conclusion
The four-layer gold finger board module PCB board is a high-performance and reliable product designed to meet the needs of modern electronic devices for connection and signal transmission. Its advanced gold finger technology and excellent electrical performance make it an ideal choice for various applications, providing stable support and efficient connection for electronic devices.
FAQ
Q: How many staffs do you have in your factory?
A: 500 + people.
Q: Are the materials used environmentally friendly?
A: The materials used comply with ROHS standards and IPC-4101 standards.
Q: Will the gold finger PCB be contaminated on the surface?
A: The surface of the gold finger may be contaminated with dirt, which will affect its normal function and use. The solution to this problem includes cleaning with appropriate cleaning agents, such as IPA solution, anhydrous ethanol, etc. These cleaning methods can effectively remove dirt on the surface of the gold finger and restore its normal function.
Q: Will the gold finger PCB change color?
A: The gold finger may change color, which may be caused by raw material problems, human factors, or SMT process factors in the production process. The solution to this problem includes cleaning with appropriate cleaning agents, such as anhydrous ethanol, or using more expensive gold plating liquid for treatment. However, it should be noted that although the gold plating liquid has good effects, it is expensive and may contain toxicity.
Q: Is the gold finger PCB solder paste printed poorly?
A: In the SMT process, if the solder paste is poorly printed and repeated printing is performed without cleaning, it may cause printing quality problems. The solution to this problem includes ensuring cleaning during the printing process to avoid quality problems caused by repeated printing.
Q: Gold finger PCB flux corrosion?
A: The flux of wave soldering may corrode the gold finger, resulting in solder marks on the gold finger. This situation is usually caused by the use of no-clean flux, which has strong penetration ability and may cause the gold finger to be corroded. The solution to this problem includes improving the welding process, using a more suitable gold finger protection flux, or performing appropriate post-processing after welding to reduce the corrosion of the flux on the gold finger.
Q: Will there be lead residues after gold finger PCB etching?
A: We can remove lead residues for thick gold fingers.
