In simple terms, immersion gold manufacture is the use of chemical deposition method, through chemical REDOX reaction on the surface of the circuit board to produce a layer of metal coating.
Here is a simple immersion gold PCB following.
 |
 |
|
 |
 |
And here are the data of the PCB in the picture.
Material: FR-4;
Minimum aperture: 0.3 mm;
Outer copper thickness: 1 OZ;
Plate thickness: 1.6 mm;
Surface treatment: immersion gold;
Application: Consumer electronics;
Number of layers: double-sided 2-layer;
Minimum line width Line distance: 0.127mm/0.127mm;
Dielectric constant: 4.3
Features: immersion gold process, aperture and dimensional tolerance requirements are strict.
This news material is comming from the Internet and is for sharing and communication only.
