Let's introduce the second type of dry etching equipment: CCP, which stands for Capacitively Coupled Plasma system.
In the CCP System, the Radio Frequency (RF) voltage between two electrodes ionizes the gas and forms plasma. One or both of these electrodes are Radio Frequency (RF) electrodes that convert electrical energy into plasma through capacitive action. Since the plasma is generated under the influence of a capacitive electric field, it is called Capacitively Coupled Plasma. This technology, known for its high energy and uniform plasma characteristics, is widely used in microelectronics manufacturing, especially in situations where precise control of the etching process is required.
In next new, we will learn about the IBE system.
