As the prosperity of the PCB industry gradually rises and the accelerated development of AI applications, the demand for server PCBs is continuously strengthening. Among them, High-Density Interconnect (HDI) technology, especially HDI products that achieve electrical interconnection between board layers using micro-buried blind via technology, is receiving widespread attention.
Several insiders from listed companies have indicated that they are beginning to select potential orders for production, and many companies are positioning themselves with products related to AI. Market analysts predict that the demand for PCBs for AI servers is transitioning towards HDI technology comprehensively, and it is expected that the usage of HDI will significantly increase in the future.
According to market news, Nvidia's GB200 server is set to officially go into production in the second half of the year, with the demand for PCBs for AI servers focusing mainly on the GPU board group. Due to the high transmission speed requirements of AI servers, the HDI boards required usually reach 20-30 layers and use ultra-low loss materials to enhance the overall value of the product.
As AI technology develops rapidly, the PCB industry is facing unprecedented opportunities. The application o f high-density interconnect technology is becoming more and more widespread, and major manufacturers are accelerating their layout to meet future market demands and technical challenges. Market analysts predict that the demand for PCBs for AI servers is transitioning comprehensively to HDI technology, and it is expected that the usage of HDI will increase significantly in the future.
