Flex-Rigid PCB with Black Solder Mask

The 4-layer hard-soft black solder mask PCB is a circuit board designed for high-performance precision instruments, which meets the needs of precision electronic equipment with its excellent performance and reliability.

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Product Description


 

Product Overview

The 4-layer hard-soft black solder mask PCB is a circuit board designed for high-performance precision instruments, which meets the needs of precision electronic equipment with its excellent performance and reliability. The product adopts a 4-layer structure, combining the stability of hard PCB and the flexibility of soft circuit, and is suitable for a variety of complex electronic systems.

 

Product Features

1. High-performance substrate: SY1001 and FR-4 substrates are used to ensure that the circuit board has excellent electrical performance and mechanical strength.

2. Fine solder mask process: black oil and white text solder mask process, providing clear line identification while protecting the circuit from environmental influences.

3. Immersion gold surface treatment: Improve the corrosion resistance and reliability of the circuit board and extend the service life of the product.

4. Hard-soft combination design: Combines the stability of hard PCB with the flexibility of soft circuit to adapt to complex space layout.

5. Gold finger design: Facilitates the connection of the circuit board with other components and improves the reliability and stability of the connection.

 

Technical Specifications

Number of layers 4 layers Ink color Black solder mask, white silk screen
Raw materials SY1001, FR-4 Minimum line width/line spacing Line width 0.1mm
Thickness 1.4mm Is there solder mask  Yes, black solder mask
Copper thickness  1 ounce (35 microns) Surface treatment method Immersion gold, gold finger, soft and hard combination

 

Application Areas

High-performance computing equipment

Industrial automation control system

High-end communication equipment

 

Special Production Process

1. High-precision multi-layer lamination technology: Ensure the precise alignment and structural stability of multi-layer circuit boards.

2. Fine line processing: Use advanced line processing technology to achieve a minimum line width and line spacing of 0.1mm to meet the needs of high-precision circuit design.

3. Soft and hard combination process: Through a special production process, the effective combination of hard PCB and soft circuit is achieved, providing a more flexible circuit design solution.

 

Product Summary

The 4-layer soft and hard combination black solder mask PCB has become an ideal choice for high-performance precision instruments with its excellent performance and reliability. By using high-quality raw materials, fine solder mask technology and advanced production technology, our products can meet the most demanding industrial application requirements. Whether in terms of stability, flexibility or durability, our 4-layer rigid-flex PCB is your trusted partner.

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