Eight-layer first-order rigid-flex board is an advanced circuit board design that combines the characteristics of flexible circuit board (FPC) and rigid circuit board (RPCB), and is widely used in high-density, high-performance electronic products.
Eight-layer first-order rigid-flex board Product Introduction
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1.Product Overview
Eight-layer first-order rigid-flex board is an advanced circuit board design that combines the characteristics of flexible circuit board (FPC) and rigid circuit board (RPCB), and is widely used in high-density, high-performance electronic products. This product is particularly suitable for applications that require complex wiring, signal integrity and miniaturized design, such as smartphones, tablets, medical equipment, automotive electronics and high-end consumer electronics.
2.Product Features
Multi-layer design:
The eight-layer structure provides abundant wiring space, which can effectively support complex circuit design and high-density connection, and meet the needs of modern electronic equipment for miniaturization and functional integration.
Combination of rigid and soft boards:
Combining the advantages of flexible and rigid circuit boards, the flexible FPC part can adapt to complex shapes and space constraints, while the rigid part provides stable support and good connection performance.
Excellent signal integrity:
The multi-layer structure can effectively reduce signal interference, ensure the stable transmission of high-frequency signals, and ensure the performance and reliability of electronic equipment.
Excellent heat dissipation performance:
The board design takes heat dissipation management into consideration, effectively dissipating heat and ensuring the stability of the equipment under high load.
Vibration resistance and durability:
Combining flexible and rigid materials, it has good vibration and impact resistance, suitable for use in various environments.
Simplified wiring:
The multi-layer design makes the wiring more concise, effectively reduces the complexity of wiring, improves manufacturing efficiency and reduces production costs.
3.Technical Parameters
| Number of layers | 8 | Minimum line width and line spacing | 0.05/0.05mm |
| Board thickness | 1.0mm | Minimum aperture | 0.2 |
| Board | S1000-2+Panasonic PI | Surface treatment | immersion gold 2U |
| Copper thickness | 1oz inner layer 1OZ outer layer | Process points | Precision circuit |
4.Application Areas
Smartphones and tablets: used to connect various sensors, cameras and display modules.
Medical equipment: used for high-precision medical instruments to ensure accurate signal transmission and stability of equipment.
Automotive electronics: used for in-vehicle navigation, ADAS (Advanced Driver Assistance System), etc. to improve safety and reliability.
Consumer electronics: such as smart home devices, wearable devices, etc., to meet the needs of high integration and miniaturization.
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5.Conclusion
The eight-layer first-order rigid-flex board has become an indispensable component in modern electronic products with its excellent performance, flexible design and high-density connection capabilities. It can meet the needs of miniaturization, high performance and reliability in various industries. We are committed to providing customers with high-quality PCB products and excellent services to help force customers to succeed in the fierce market competition.
FAQ
Q: The flexible part is easy to break?
A: When making, glue is applied to the connection between soft and hard to solidify.
Q:The thermal expansion coefficient is inconsistent. The soft and hard materials will generate stress after being heated, causing the board to deform or crack?
A: When designing, special attention should be paid to using materials with the same or similar thermal expansion coefficients to reduce the problems caused by this mismatch.
Q: Do you produce the entire process of hard-soft boards by yourself?
A: Yes.
Q: Can you make hard-soft boards for HDI?
A: Yes, we can make 18-layer 6-order hard-soft boards.
Q: Is your hard-soft board delivery fast?
A: Generally, the delivery time for ordinary samples is 2 weeks after EQ confirmation and 3 weeks for HDI.
