The 8-layer immersion gold hard-soft PCB is a high-density multi-layer printed circuit board manufactured with advanced hard-soft technology.
8-Layer Immersion Gold Soft and Hard Combination PCB Product Introduction
1.Product Overview
The 8-layer immersion gold hard-soft PCB is a high-density multi-layer printed circuit board manufactured with advanced hard-soft technology. It combines the strength of a hard board with the flexibility of a soft board, and is suitable for electronic devices that require complex connections and space utilization. This PCB has become an ideal choice for high-end electronic products with its excellent performance and flexibility.
2.Product Features
1. Hard-soft technology: combines the rigidity of a hard board with the flexibility of a soft board to provide a more flexible circuit design.
2.8-layer structure design: provides more wiring layers, effectively reduces signal interference, and improves circuit performance.
3. immersion gold surface treatment: improves welding reliability and enhances the corrosion resistance of the circuit board.
4. Fine line design: achieves smaller component spacing and improves the space utilization of the circuit board.
5. High reliability: selects high-quality raw materials to ensure stability and reliability in complex environments.
3.Technical Specifications
| Number of layers | 8 layers | Copper thickness | 1 oz/35 microns |
| Raw materials | Tg halogen-free FR-4 epoxy fiberglass substrate, combined with FPC soft board material | Ink color | Green, transparent (soft board) |
| Thickness Hard board | 1.6mm | Minimum line width/line spacing Line width | 0.1mm, line spacing: 0.1mm |
| soft board | 0.2mm | Is there a solder mask | Yes, using a green solder mask |
| Surface treatment method | Immersion gold | / | / |
4.Application areas
1. High-end smartphones
2. Wearable devices
3. Flexible display screens
4. Aerospace electronic equipment
5. Industrial control systems
5.Production Processes
Laser drilling technology: ensure drilling accuracy and improve PCB reliability.
Lamination technology: ensure the strength and flatness of the combination of hard and soft boards.
Automated production line: improve production efficiency and consistency of product quality.
Immersion gold technology: enhances solderability, corrosion resistance, conductivity, stability, and beautifies appearance.
6.Product Summary
The 8-layer immersion gold hard-soft PCB has become an indispensable component in high-end electronic products with its soft-hard combination technology, 8-layer structure design, immersion gold surface treatment, fine circuit design and high reliability. It not only meets the demand for high-performance circuit boards, but also ensures the quality and performance of the products through special production processes. This PCB is a manifestation of technological progress in the field of electronic manufacturing, and provides a solid foundation for the stable operation and performance improvement of high-end electronic products.
FAQ
1.Q: What files are used in PCB production?
A: PCB production requires Gerber files and PCB manufacturing specifications, such as the required substrate material, finished thickness, copper layer thickness, solder mask color, and design layout requirements.
2.Q: When can I get a quotation after I provide Gerber, product process requirements?
A: Our sales staff will give you a quotation within 1 hour.
3.Q:How to ensure precise alignment between rigid and flexible sections during rigid-flex PCB design?
A: In the design of rigid-flex PCB, CAD software should be used to ensure precise alignment between rigid and flexible sections. Proper layout can enhance the stability and performance of the circuit, while optimized connection methods can improve the reliability and durability of the circuit.
4.Q: How to ensure the reliability of electrical connections during the manufacturing process of rigid-flex PCB?
A: During the manufacturing process of rigid-flex PCB, mechanical drilling and copper plating steps are necessary. Mechanical drilling is performed at designated locations to facilitate the installation of components or to achieve inter-layer connections. Copper plating, whether through chemical or electroplating methods, deposits a layer of copper on the wall of the holes to ensure reliable electrical connections.
